Microelectronic Packaging & Assembly Solutions

Quik-Pak, specializes in advanced IC Assembly and Prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The company offers Packaging and Assembly services in 24 hours or less. Quik-Pak also offers complete Wafer & Die Preparation services, including Backgrinding, Dicing, Bumping, Pick & Place and Inspection.

The company's Advanced Assembly services meet the unique requirements for Flip Chip, Chip-on-Board (COB), Stacked Die, Multi-Chip Module (MCM), System-in-Package (SIP), Ceramic, BGA and MEMS devices. Custom Assembly services include Die Bonding, Gold Wire Ball Bonding, Encapsulation & Remolding and Marking. Quik-Pak's Laser Micromachining capability creates vast opportunities for package... (more)

Sample-Making

A sample is a prototype of your idea. Sample-makers usually make the product by hand (hand-cutting, hand-assembling, etc.) before you get your tooling finalized. You want your sample to be perfect if you plan to do mass production of your product.

(Usually sample-makers charge more per product, but this depends on the factory’s policy.)

Production

"Production run" means making a lot of one product at once. The factories listed under "production" can produce small and/or large quantities. The minimum order for a production run can vary from factory to factory (some have no minimum, some require a dozen, and some require up to 1,000 to be made at once)