i2a Technologies offers a range of assembly solutions to meet your IC Packaging needs utilizing wire bonding and wafer bumping technologies in a variety of package families.

i2a Technologies is engaged principally in the development and assembly activities related to QFP, BGA, fpBGA, CSP, SIP, QFN / DFN, Wafer bumping, WLCSP, COC (chip on chip) and multi-chip packaging technology, using both wire-bonding as well as flip-chip interconnect technologies. We provide miniaturization technologies for the electronics industry. As such, we enable improvements in miniaturization and performance by applying our expertise in the electrical, thermal and mechanical properties of materials and interconnect. Our intellectual property, covers a range of advanced semiconductor packaging and interconnect solutions. We build our customer's products based on miniaturization technology as well as license the... (more)

Sample-Making

A sample is a prototype of your idea. Sample-makers usually make the product by hand (hand-cutting, hand-assembling, etc.) before you get your tooling finalized. You want your sample to be perfect if you plan to do mass production of your product.

(Usually sample-makers charge more per product, but this depends on the factory’s policy.)

Tooling

To produce products at a rapid rate and drive your cost down, you might have to invest in machinery that is customized to your design; that is "tooling". This machinery will vary depending on the product, but can range from plastic molds to custom branding stamps, and so on.

Production

"Production run" means making a lot of one product at once. The factories listed under "production" can produce small and/or large quantities. The minimum order for a production run can vary from factory to factory (some have no minimum, some require a dozen, and some require up to 1,000 to be made at once)